High-power MOSFET, ultra-high efficiency conversion, reducing losses and extending flight time
30.5mm installation hole spacing is more suitable for large-sized load-type flight vehicles and is easy to install.
Supports digital protocol DShot600/300/150 and is compatible with Oneshot/MultiShot/PWM protocol.
Innovative angled solder pad reduces the difficulty of welding. Multi-layer PCB design increases over-current capability, effectively dissipating heat.











